Sandwich Panel Bonding

Prior to bonding loosely assemble panels together ensuring all joins mate fully. All bonded joints will require clamping during cure. Clamps should not apply pressure to the joint directly, but to the panel surface adjacent to each joint. Ensure clamp pressure is spread evenly down the panel. Prepare tooling as required to ensure corners will be cured under pressure 90 ° to each other. Structure may be bonded in stages to improve ease of manufacture.

Clean all mating surface prior to bonding by removing loose material. Use only oil-free compressed air. Lightly abrade bonding surface of panel skins (tongue sections) using 240 grit paper or 220 grit aluminium oxide grit blast. Protect non-bonding surfaces and core against sanding/grit blast damage.

Remove all dust using oil-free compressed air and wipe bonding surfaces clean using a clean white cloth moistened with MEK. Wipe in one direction only using a new section of cloth for each wipe. Wipe exposed core clean using MEK to remove surface contaminants. Do not allow MEK to pool on surface. Protect prepared surfaces from contamination.

All panel intersections are to be bonded with Hysol EA9309.3NA adhesive. Prepare adhesive in accordance with EA9309.3NA data sheet. A small amount, maximum 5% by weight of phenolic microballoon may be used to thicken adhesive if required. Ensure all bonding is carried out in a dust-free environment. Personnel handling cleaned and surface prepared components are to wear disposable gloves.

Apply EA9309.3NA to the core and skin surfaces of all mating components (tongues and grooves). Apply sufficient adhesive to the core components to fill exposed cells. Sufficient adhesive is to be applied to the skin surfaces to ensure squeeze-out of the adhesive occurs during bonding.

Clamp panels together, progressively increasing clamping pressure until joints are held solidly and a square assembly is achieved. Clamp only using hand force to tighten. Do not over clamp.

Form a fillet of adhesive along the inner surface of each joint nominally 2mm x 2mm wide except along the joints where internal reinforcing angles are to be installed. Ensure exposed core of finger joints are filled with adhesive. Clean up remaining adhesive using a cloth moistened with MEK prior to the adhesive curing. Retain a small amount of adhesive on a separate piece of aluminium to verify proper cure.

Cure in accordance with Hysol EA9309.3NA data sheet. Remove clamps after cure and check integrity of the bond by applying slight pressure to the joints and check the squareness of the assembly.

Bonding Internal Reinforcing Angles

Lightly abrade bonding surface of panel skins and angle sections using 240 grit paper or 220 grit aluminium oxide grit blast. Protect non-bonding surfaces and core against sanding/grit blast damage.

Remove all dust using oil-free compressed air and wipe bonding surfaces clean using a clean white cloth moistened with MEK. Wipe in one direction only using a new section of cloth for each wipe. Continue wiping until no discolouration of the cloth occurs. Do not allow MEK to pool on surface.

Wipe each bonding surface with Turco WO1 using a clean white cloth to apply the etch primer. Wash primed surfaces with clean water. Protect prepared surfaces from contamination.

Reinforcing angles are to be bonded with Hysol EA9309.3NA adhesive. Prepare adhesive in accordance with EA9309.3NA data sheet. Ensure all bonding is carried out in a dust-free environment. Personnel handling cleaned and surface prepared components are to wear disposable gloves.

Apply EA9309.3NA to the bonding surfaces of the reinforcing angles Sufficient adhesive is to be applied to the angle surfaces to ensure squeeze-out of the adhesive occurs during bonding.

Clamp angles in place, progressively increasing clamping pressure until angles are held solidly. Clamp only using hand force to tighten. Do not over clamp.

Form a fillet of adhesive along the edges of each clamp flange. Clean up remaining adhesive using a cloth moistened with MEK prior to the adhesive curing. Retain a small amount of adhesive on a separate piece of aluminium to verify proper cure.

Cure in accordance with Hysol EA9309.3NA data sheet. Remove clamps after cure and check integrity of the bond by tap testing for voids. No voids permitted.

Edge Filling Sandwich Panels

All exposed core edges are to be filled with Hysol EA9309.3NA/Microballoon mix after assembly.

Push the core back from the edge of the panel skins approximately 2-3mm.

Prepare adhesive in accordance with EA9309.3NA data sheet. A small amount, maximum 15-20% by volume of phenolic microballoon may be used to thicken adhesive if required.

Fill the gap between the panel skins flush with the edge of the panel using the adhesive mix. Clean up remaining adhesive using a cloth moistened with MEK prior to the adhesive curing.

Cure in accordance with Hysol EA9309.3NA data sheet.

Bonding Non-Structural Edging Angles

Remove all dust using oil-free compressed air and wipe bonding surfaces clean using a clean white cloth moistened with MEK. Wipe in one direction only using a new section of cloth for each wipe. Continue wiping until no discolouration of the cloth occurs. Do not allow MEK to pool on surface.

Edging angles are to be bonded with Hysol EA9309.3NA adhesive. Prepare adhesive in accordance with EA9309.3NA data sheet. Ensure all bonding is carried out in a dust-free environment. Personnel handling cleaned and surface prepared components are to wear disposable gloves.

Apply EA9309.3NA to the bonding surfaces of the edging angles Sufficient adhesive is to be applied to the angle surfaces to ensure squeeze-out of the adhesive occurs during bonding.

Clamp angles in place, progressively increasing clamping pressure until angles are held solidly. Clamp only using hand force to tighten. Do not over clamp.

Form a fillet of adhesive along the edges of each clamp flange. Clean up remaining adhesive using a cloth moistened with MEK prior to the adhesive curing.

Cure in accordance with Hysol EA9309.3NA data sheet. Remove clamps after cure and check integrity of the bond by applying light pressure to the angles.